Infineon to acquire Dresden-based Siltectra for €124M, will use startup’s Cold Split technology to split wafers, thus doubling the number of chips on them (David Manners/Electronics Weekly)
David Manners / Electronics Weekly:
Infineon to acquire Dresden-based Siltectra for €124M, will use
startup’s Cold Split technology to split wafers, thus doubling the
number of chips on them — Infineon has bought
Siltectra of Dresden, a start-up with an innovative technology
(Cold Split) to process crystal material efficiently and with
minimal loss of material.
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